Iridium Sputtering Targets (Ir)

Why Choose Iridium Sputtering Targets From AEM?

Cutting-edge Quality: Utilizing state-of-the-art manufacturing technologies, we are committed to delivering high-quality Iridium sputtering targets. Our rigorous testing processes ensure that our targets not only meet but exceed industry standards.

Customer Satisfaction and Trust: With years of dedicated effort, we have earned the trust of countless customers, including being the chosen supplier for Stanford University. Our professional team is dedicated to providing top-notch services, building long-term relationships based on satisfaction and trust.

Global Impact and Accessibility: Serving clients globally, our efficient distribution network ensures prompt deliveries. Wherever you are, accessing our high-quality Iridium sputtering targets is seamless. We provide comprehensive support and guidance throughout the purchasing process, ensuring a seamless experience for our global clientele.

Expert Technical Team: With over a decade of industry experience, our technical team can provide tailored advice based on your specific needs.

Manufacturing Processes of Iridium Sputtering Targets

1. Raw material preparation: choose iridium powder of 4n and above purity, powder particle size is 1～10μm.
2. Cold press molding: put the powder into the mold for cold press molding, cold press pressure of 100 ~ 300mpa, holding time of 10 ~ 60min.



3. Low-temperature microwave sintering: the cold-pressing molding of ingot blanks for microwave sintering, first of all, vacuum to 1x10-2Pa ~ 1X10-3pa, and then pass into the high-purity hydrogen to 1 ~ 10pa, followed by heating to the sintering temperature of 400 ~ 800 ℃ for sintering, which the microwave frequency of 2.45ghz, the rate of temperature rise of 10 ~ 50 ℃ / min, the sintering time of 10 ~ 30min, sintering time arrived, the ingot blanks, the sintering time of 10 ~ 30min. After the sintering time is reached, the ingot billet is cooled down with the furnace, and after cooling down to room temperature, the hydrogen is turned off and the ingot billet is taken out.
4. Low-temperature vacuum hot pressing: the microwave sintered ingot billet for vacuum hot pressing sintering treatment, sintering temperature of 400 ~ 900 ℃, heating rate of 10 ~ 30 ℃ / min, hot pressing pressure of 100 ~ 300mpa, sintering time of 30 ~ 60min, the vacuum degree of 1x10-3Pa ~ 1X10-4pa, sintering time to reach, according to 10 ~ 30mpa / min of the decompression rate of decompression, sintering time of 10 ~ 30mpa / min. After sintering time is reached, the ingot billet is depressurized at the rate of 10-30mpa/min, the ingot billet is cooled down with the furnace, and the ingot billet is taken out after it is cooled down to room temperature.
5. Machining: Machining treatment to get the target products of the required size.

This process is a preparation of iridium sputtering targets with highly oriented grain orientation.

Iridium Sputtering Targets Production Process Control

1. Incoming Materials Management

• Procure high-quality Iridium powder from reliable suppliers.
• Conduct rigorous incoming inspections on the raw materials, assessing appearance, purity, particle size, and chemical properties.
• Ensure appropriate storage conditions for the raw materials to prevent moisture, contamination, or other adverse effects.
• Precise Inventory Management:
  Establish accurate inventory records and tracking systems for real-time monitoring of Procure high-quality Iridium powder from reliable suppliers.
• Conduct rigorous incoming inspections on the raw materials, assessing appearance, purity, particle size, and chemical properties.
• Ensure appropriate storage conditions for the raw materials to prevent moisture, contamination, or other adverse effects.
• Precise Inventory Management:
  Establish accurate inventory records and tracking systems for real-time monitoring of iridium powder. Implement the First-In, First-Out (FIFO) principle to utilize earlier purchased materials first.
• Quality Control and Testing:
  Perform quality testing on raw materials obtained from suppliers to ensure compliance with Iridium sputtering targets preparation requirements. Conduct periodic sampling inspections and testing of raw materials to ensure quality stability and adherence to standards.
• Supply Chain Management:
  Establish stable partnerships with raw material suppliers to ensure continuous and stable supply. Regularly assess and review supplier performance to ensure alignment with company quality requirements and standards. Implement the First-In, First-Out (FIFO) principle to utilize earlier purchased materials first.
• Quality Control and Testing:
  Perform quality testing on raw materials obtained from suppliers to ensure compliance with Iridium sputtering targets preparation requirements. Conduct periodic sampling inspections and testing of raw materials to ensure quality stability and adherence to standards.
• Supply Chain Management:
  Establish stable partnerships with raw material suppliers to ensure continuous and stable supply. Regularly assess and review supplier performance to ensure alignment with company quality requirements and standards.

2. Process Management

• Raw Material Management: Ensuring high purity, appropriate particle size, and powder mixing ratio of raw materials to ensure the final chemical composition and performance of the product meet specifications.
• Production Process Monitoring: Precisely controlling pressure, temperature, and time parameters during the hot-press sintering process to ensure uniform bonding of powder particles, resulting in dense and uniform sputtering targets.
• Environmental Control: Maintaining stable and clean production environments to prevent external factors from impacting the production process and ensuring consistent Iridium targets quality.
• Documentation and Traceability: Detailed documentation of key parameters and data throughout the entire production process, establishing a traceability system to ensure the traceability of product quality.

3. Quality Assurance

Iridium sputtering targets will undergo inspection by the quality and technical supervision department to ensure that the product quality complies with the specified standards or the terms outlined in the purchase order (contract).

4.Monitoring and Test Equipment Management

• Appearance Inspection: Check the surface of the target material for smoothness, absence of cracks, bubbles, or any visible defects.
• Dimensional Inspection: Measure the target material's dimensions, thickness, and geometric shape to ensure compliance with specified standards and requirements.
• Chemical Analysis: Employ chemical analysis methods like X-ray Fluorescence Spectroscopy (XRF), Inductively Coupled Plasma Mass Spectrometry (ICP-MS), etc., to confirm that the chemical composition meets the standards.
• Electrical Property Testing: Conduct tests on the target material's electrical properties such as resistivity, conductivity, etc., to verify if they meet the expected performance.
• Structural and Microscopic Observation: Utilize microscopy or Scanning Electron Microscopy (SEM) to observe the internal structure and surface morphology of the target material.
• Optical Property Testing: Perform tests on optical properties like transmittance, reflectance.

Inspection Details