Sputtering Targets
Evaporation Materials
Evaporation Sources
High Purity Materials
Thin Film Substrates
Crytstal Materials
Sputtering Targets
Grade | Chemical Composition (%) | ||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|
C | Fe | Ni | Mo | Co | V | Si | Al | Cu | Mn | ||
DT-4/Ingot Iron | ≤0.03 | ≥99.75 | |||||||||
Si6.5Fe/X-Flux | ≤0.03 | Bal. | 6.5-8.5(adjustable) | ||||||||
1J50/Hyperm52 | ≤0.03 | Bal. | 49.0-50.0 | 0.15-0.3 | ≤0.2 | 0.3-0.6 | |||||
1J22/Permendur | ≤0.04 | Bal. | ≥0.5 | 49-51 | 0.8-1.8 | ≤0.3 | ≤0.2 | ≤0.5 | |||
1J1/SENDUST | ≤0.03 | Bal. | 8.0-10.0 | 4.5-7.5 | |||||||
1J79/Mo-Permalloy | ≤0.03 | Bal. | 78.5-80.0 | 3.8-4.1 | 0.3-0.5 | ≤0.2 | 0.6-1.1 |