Aluminum Copper Sputtering Targets (Al/Cu)
Aluminum Copper Sputtering Targets
AEM Deposition specializes in producing high purity Aluminum Copper (Al/Cu) Sputtering Targets with the highest possible density. High purity (99.9%) Aluminum Copper Sputtering Targets with the smallest possible average grain sizes can be used for semiconductor, chemical vapor deposition (CVD), and physical vapor deposition (PVD) display and optical applications.
Aluminum Copper Sputtering Targets Information
Aluminum Copper Sputtering Targets
Purity: 99.9%;
Circular: Diameter <= 14 inch, Thickness >= 1mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm.
More Information on Copper Aluminum Sputtering Targets
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Applications • Semiconductor • Chemical Vapor Deposition (CVD) • Physical Vapor Deposition (PVD) |
Features • Competitive pricing • High purity • Grain refined, Engineered microstructure • Semiconductor grade |
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Manufacturing Process • Refining Three-layer electrolytic process • Melting and casting Electrical resistance furnace - Semi-continuous casting • Grain refinement Thermomechanical treatment • Cleaning and final packaging - Cleaned for use in vacuum Protection from environmental contaminants Protection during shipment |
Options • 99.9% minimum purity • Smaller sizes also available for R&D applications • Sputtering target bonding service |
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Evaporation Materials |
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Metal Powders Aluminium Powder |
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