Gold Tin Sputtering Targets (Au/Sn 80/20 wt%)
Material Type | Gold Tin |
Symbol | Al/Sn 80/20 wt% |
Color/Appearance | Gold-colored solid |
Thermal Conductivity | 57 W/m.K |
Melting Point (°C) | 280 |
Coefficient of Thermal Expansion | 16 x 10-6/K |
Sputter | DC |
Type of Bond | Indium, Elastomer |
Comments |
Gold Tin Sputtering Targets
Gold Tin (Au/Sn, or 80% gold, 20% tin by weight ) is a unique material. It is used in a variety of applications requiring high reliability, high melting solder joint. This particular alloy of gold-tin (Au/Sn) has a melting temperature of 280ºC, lower than the 350ºC transition temperature into brazing materials. Still, there are some similarities between this solder alloy and braze alloys. The most obvious is the hardness of the gold-tin (AuSn) alloy. With a tensile strength of 40,000PSI, this solder is much more rigid than the tin solder. The strength is more closely compared to the silver brazes, which melt above 500C.
Gold Tin Sputtering Targets Information
Gold Tin Sputtering Targets (Au/Sn 80/20 wt%)
Purity: 99.9%;
Circular: Diameter <= 14 inch, Thickness >= 1mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm.
More Information on Gold Tin Sputtering Targets
Applications• Semiconductor• Chemical Vapor Deposition (CVD) • Physical Vapor Deposition (PVD) |
Features• Competitive pricing• High purity • Grain refined, Engineered microstructure • Semiconductor grade |
Manufacturing Process• RefiningThree-layer electrolytic process • Melting and casting Electrical resistance furnace - Semi-continuous casting • Grain refinement Thermomechanical treatment • Cleaning and final packaging - Cleaned for use in vacuum Protection from environmental contaminants Protection during shipment |
Options• 99.9% minimum purity• Smaller sizes also available for R&D applications • Sputtering target bonding service |
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