Bismuth Titanate Sputtering Targets (Bi4Ti3O3)
| Material Type | Bismuth Titanate |
| Symbol | Bi4Ti3O12 |
| Color/Appearance | Yellow, Solid |
| Melting Point (°C) | 870 |
| Relative Density (g/cc) | >90% |
| Z Ratio | N/A |
| Sputter | RF, DC |
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Max Power Density* (Watts/Square Inch) |
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| Type of Bond | Indium, Elastomer |
| Comments |
Bismuth Titanate Sputtering Targets
Bismuth Titanate Sputtering Targets
Purity: 99.99%;
Circular: Diameter <= 14 inch, Thickness >= 1 mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1 mm.
More Information on Bismuth Titanate Sputtering Targets
Applications• Ferroelectric• Gate Dielectric • For CMOS
• Non-volatile memory
• Thin film capacitor
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Features• High purity• Custom sizes available |
Manufacturing Process• Manufacturing - Cold pressed - Sintered, Elastomer bonded to backing plate
• Cleaning and final packaging, Cleaned for use in vacuum, |
Options
• 99.99% minimum purity
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
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Related Products of Bismuth Titanate Sputtering Targets
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Ceramic Sputtering Targets |
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Evaporation Materials |
Crucibles N/A |
Metal Powders N/A |
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