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Lanthanum Copper Manganate Sputtering Targets (La2CuMnO6)

Material Type	Lanthanum Copper Manganate
Symbol	La₂CuMnO₆, LCMO
Color/Appearance	Various colors, Solid
Melting Point (°C)	N/A

Relative Density (g/cc)	>90%
Z Ratio	N/A
Sputter	RF, RF-R, DC
Max Power Density* (Watts/Square Inch)	N/A
Type of Bond	Indium, Elastomer
Comments

Lanthanum Copper Manganate Sputtering Targets

Lanthanum Copper Manganate Sputtering Targets
Purity: 99.9%;
Circular: Diameter <= 14 inch, Thickness >= 1 mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1 mm.
Bonding is recommended for these materials. Many materials have characteristics that are not amenable to sputtering, such as brittleness and low thermal conductivity. This material may require a special ramp up and ramp down procedures. This process may not be necessary for other materials. Targets that have low thermal conductivity are susceptible to thermal shock.

More Information on Lanthanum Copper Manganate Sputtering Targets

Applications

• Ferroelectric
• Gate dielectric

• For CMOS

• Non-volatile memory

• Thin film capacitor

Features

• High purity
• Custom sizes available

Manufacturing Process

• Manufacturing - Cold pressed - Sintered, Elastomer bonded to backing plate

• Cleaning and final packaging, Cleaned for use in vacuum,
Protection from environmental contaminants
Protection during shipment

Options

• 99.99% minimum purity

• Smaller sizes also available for R&D applications

• Sputtering target bonding service

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