Bismuth Sputtering Targets (Bi)
Material Type | Bismuth |
Symbol | Bi |
Atomic Weight | 208.9804 |
Atomic Number | 83 |
Color/Appearance | Lustrous Reddish White, Metallic |
Thermal Conductivity | 8 W/m.K |
Melting Point (°C) | 271 |
Coefficient of Thermal Expansion | 13.4 x 10-6/K |
Theoretical Density (g/cc) | 9.8 |
Z Ratio | 0.79 |
Sputter | DC |
Max Power Density* (Watts/Square Inch) |
10 |
Type of Bond | Indium, Elastomer |
Export Control (ECCN) | 1C229 |
Comments | Resistivity high. Low Melting Point materials not ideal for sputtering. |
Bismuth Sputtering Targets
Bismuth is a chemical element with the symbol Bi and atomic number 83. Bismuth, a pentavalent post-transition metal and one of the pnictogens, chemically resembles its lighter homologs arsenic and antimony. Elemental bismuth may occur naturally, although its sulfide and oxide form important commercial ores. The free element is 86% as dense as Lead. It is a brittle metal with a silvery-white color when freshly formed, but surface oxidation can give it a pink tinge. Bismuth is the most naturally diamagnetic element and has one of the lowest thermal conductivity values among metals.
Bismuth Sputtering Targets Information
Bismuth Sputtering Targets
Purity: 99.9-99.999%;
Circular: Diameter <= 14 inch, Thickness >= 1mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm.
More Information on Bismuth Sputtering Targets
Applications• Electronics• Semiconductor • Flat panel displays |
Features• Competitive pricing• High purity • Grain refined, Engineered microstructure • Semiconductor grade |
Manufacturing Process• RefiningThree-layer electrolytic process • Melting and casting Electrical resistance furnace - Semi-continuous casting • Grain refinement Thermomechanical treatment • Cleaning and final packaging - Cleaned for use in vacuum Protection from environmental contaminants Protection during shipment |
Options• 99.9% minimum purity• Smaller sizes also available for R&D applications • Sputtering target bonding service |
Related Products of Bismuth Sputtering Targets
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Ceramic Sputtering Targets |
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Evaporation Materials |
Crucibles N/A |
Metal Powders N/A |
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