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Pyrolytic Graphite Sputtering Targets (C)

Material Type	Pyrolytic Graphite
Symbol	C
Atomic Weight	12.0107
Atomic Number	6
Color/Appearance	Black, Non-Metallic
Thermal Conductivity	140 W/m.K
Melting Point (°C)	~3,652

Coefficient of Thermal Expansion	7.1 x 10-6/K
Theoretical Density (g/cc)	2.25
Z Ratio	3.26
Sputter	PDC
Max Power Density* (Watts/Square Inch)	80
Type of Bond	Indium, Elastomer
Comments	E-beam preferred. Arc evaporation. Poor film adhesion.

Pyrolytic Graphite Sputtering Targets

Comparing with standard carbon graphite targets, the pyrolytic graphite sputtering targets are much more directional and have the ability to sputter at higher rates.The Pyrolytic Graphite targets are made by chemical vapor deposition (CVD) and are grown atom-by-atom, which resulting the material has better thermal, electrical and chemical properties. Due to the nature of the deposition process by CVD, Pyrolytic Graphite material approaches the theoretical density and is essentially non-porous so outgassing occurs quickly.

Pyrolytic Graphite Sputtering Targets Information

Pyrolytic Graphite Sputtering Targets
Purity: 99.99%;
Circular: Diameter <= 14 inch, Thickness >= 1mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm.

More Information on Pyrolytic Graphite Sputtering Targets

Applications • Electronics • Semiconductor • Flat panel displays	Features • Competitive pricing • High purity • Grain refined, Engineered microstructure • Semiconductor grade
Manufacturing Process • Refining Three-layer electrolytic process • Melting and casting Electrical resistance furnace - Semi-continuous casting • Grain refinement Thermomechanical treatment • Cleaning and final packaging - Cleaned for use in vacuum Protection from environmental contaminants Protection during shipment	Options • 99.99% minimum purity • Carbide targets Boron Carbide, Hafnium Carbide, Molybdenum Carbide, Niobium Carbide, Silicon Carbide, Tantalum Carbide, Titanium Carbide, Tungsten Carbide, Vanadium Carbide, Zirconium Carbide Sputtering Targets • Sputtering target bonding service

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