Tungsten Disulfide Sputtering Targets (WS2)
| Material Type | Tungsten Disulfide |
| Symbol | WS2 |
| Color/Appearance | Dark Gray, Crystalline Solid |
| Melting Point (°C) | 1,250 |
| Theoretical Density (g/cc) | 7.5 |
| Z Ratio | **1.00 |
| Sputter | RF |
| Type of Bond | Indium, Elastomer |
Tungsten Disulfide Sputtering Targets
Tungsten Disulfide Sputtering Targets Information
Tungsten Disulfide Sputtering Target,
Purity: 99.9%;
Circular: Diameter <= 14 inch, Thickness >= 1mm;
Block: Length <= 1.4m(by several pieces construction), Width <= 12 inch, Thickness >= 1mm.
Bonding is recommended for these materials. Many materials have characteristics that are not amenable to sputtering, such as brittleness and low thermal conductivity. This material may require a special ramp up and ramp down procedures. This process may not be necessary for other materials. Targets that have low thermal conductivity are susceptible to thermal shock.Tungsten Sulfide (WS2) is commonly used in electronic industries.
More Information on Tungsten Disulfide Sputtering Targets
Applications• Chemical Vapor Deposition (CVD)• Physical Vapor Deposition (PVD) • Semiconductor • Optical |
Features• High purity• Custom sizes available |
Manufacturing Process• Manufacturing - Hot pressed - Sintered, Elastomer bonded to backing plate
• Cleaning and final packaging, Cleaned for use in vacuum, |
Options
• 99.8% minimum purity
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
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Related Products of Tungsten Disulfide Sputtering Targets
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Ceramic Sputtering Targets Tungsten Oxide Sputtering Target |
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Evaporation Materials Tungsten Evaporation Pellet |
Crucibles Tungsten Crucible |
Metal Powders Tungsten Powder |
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