Copper Silver Sputtering Targets (Cu/Ag 84:16 wt%)
Copper Silver Sputtering Targets
Copper Silver Sputtering Targets
Purity: 99.9%;
Circular: Diameter <= 14 inch, Thickness >= 1mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm.
More Information on Copper Sliver Sputtering Targets
Applications• Semiconductor• Chemical Vapor Deposition (CVD) • Physical Vapor Deposition (PVD) |
Features• Competitive pricing• High purity • Grain refined, Engineered microstructure • Semiconductor grade |
Manufacturing Process• RefiningThree-layer electrolytic process • Melting and casting Electrical resistance furnace - Semi-continuous casting • Grain refinement Thermomechanical treatment • Cleaning and final packaging - Cleaned for use in vacuum Protection from environmental contaminants Protection during shipment |
Options• 99.9% minimum purity• Smaller sizes also available for R&D applications • Sputtering target bonding service |
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