Aluminum Oxide Sputtering Targets (Al2O3)
| Material Type | Aluminum Oxide |
| Symbol | Al2O3 |
| Color/Appearance | White, Crystalline Solid |
| Melting Point (°C) | 2,072 |
| Theoretical Density (g/cc) | 3.97 |
| Z Ratio | 0.336 |
| Sputter | RF-R |
|
Max Power Density* (Watts/Square Inch) |
20 |
| Type of Bond | Indium, Elastomer |
| Comments | Sapphire excellent in E-beam; forms smooth, hard films. |
Aluminum Oxide Sputtering Targets
Aluminium oxide (British English) or aluminum oxide (American English) is a chemical compound of aluminum and oxygen with the chemical formula Al2O3. It is the most commonly occurring of several aluminum oxides and identified explicitly as Aluminum(III) oxide. It is frequently called alumina and may also be called alkoxide, aloxite, or alundum, depending on particular forms or applications. It occurs naturally in its crystalline polymorphic phase. Al2O3 as the mineral corundum, varieties of which form the precious gemstones ruby and sapphire. Al2O3 is significant in producing aluminum metal as an abrasive due to its hardness and refractory material due to its high melting point.
Aluminum Oxide Sputtering Targets Information
Aluminum Oxide Sputtering Targets
Purity: 99.9%;
Circular: Diameter <= 14 inch, Thickness >= 1 mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1 mm.
Elastomer Bonding is recommended for these materials. Many materials have characteristics that are not amenable to sputterings, such as brittleness and low thermal conductivity.
We also have high quality pure aluminum sputtering targets for sale with 99.99-99.999% purity.
More Information on Aluminum Oxide Sputtering Targets
Applications• Ferroelectric• Gate Dielectric • For CMOS
• Non-volatile memory
• Thin film capacitor
|
Features• High purity• Custom sizes available |
Manufacturing Process• Manufacturing - Cold pressed - Sintered, Elastomer bonded to backing plate
• Cleaning and final packaging, Cleaned for use in vacuum, |
Options
• 99.9% minimum purity
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
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