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Lanthanum Aluminate Sputtering Targets (LaAlO3)

Material Type	Lanthanum Aluminate
Symbol	LaAlO₃
Color/Appearance	White / Off-white, Crystalline Solid
Melting Point (°C)	2,080

Theoretical Density (g/cc)	6.52
Z Ratio	N/A
Sputter	RF, RF-R, DC
Max Power Density* (Watts/Square Inch)	20
Type of Bond	Indium, Elastomer
Comments

Lanthanum Aluminate Sputtering Targets

The crystal structure of Lanthanum Aluminate is Perovskite. LaAlO3 crystals are commonly used as substrates for depositing high-temperature superconducting films. LaAlO3 thin films have promising scientific and technological applications, such as in electronic transducers, thin-film capacitors, computer memory cells.

Lanthanum Aluminate Sputtering Targets Information

Lanthanum Aluminate Sputtering Targets
Purity: 99.9%;
Circular: Diameter <= 14 inch, Thickness <= 15 mm;
Block: Length <= 120 +/-0.1 mm, Width <= 120 +/-0.1 mm,Thickness <= 15 mm.
Bonding is recommended for these materials. Many materials have characteristics that are not amenable to sputtering, such as brittleness and low thermal conductivity. This material may require a special ramp up and ramp down procedures. This process may not be necessary for other materials. Targets that have low thermal conductivity are susceptible to thermal shock.

More Information on Lanthanum Aluminate Sputtering Targets

Applications

• Thermal barrier, Catalyst
• Superconducting, Solid oxide fuel cell

• Super capacitor
• Electromagnetic device

Features

• High purity & density
• Custom sizes available
• Single phase

• Relative density: >=85%

Manufacturing Process

• In-house powder synthesis, High purity metal oxide precursor materials, High energy mixing, Particle sizing processes

• Multiple step densification, Proprietary processes employed for pressing and sintering

• Cleaning and final packaging, Cleaned for use in vacuum, Protection from environmental contaminants, Protection during shipment

Options

• 99.9% minimum purity

• Custom compositions may be available upon request

• Smaller sizes also available for R&D applications

• Sputtering target bonding service

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