Tin Oxide Sputtering Targets (SnO2)
| Material Type | Tin Oxide |
| Symbol | SnO2 |
| Color/Appearance | White or Gray, Crystalline Solid |
| Melting Point (°C) | 1,630 |
| Theoretical Density (g/cc) | 6.95 |
| Z Ratio | **1.00 |
| Sputter | RF, RF-R |
|
Max Power Density* (Watts/Square Inch) |
20 |
| Type of Bond | Elastomer |
| Comments | Films from W are oxygen deficient; oxidize in air. |
Tin Oxide Sputtering Targets
Tin dioxide (tin(IV) oxide), also known as stannic oxide, is the inorganic compound with the formula SnO2. The mineral form of SnO2 is called cassiterite, and this is the primary ore of tin. With many other names, this oxide of tin is an essential raw material in tin chemistry. It is a colorless, diamagnetic, and amphoteric solid.
Tin Oxide Sputtering Targets Information
Tin Dioxide Sputtering Targets
Purity: 99.99%;
Circular: Diameter <= 14 inch, Thickness >= 1mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm.
Elastomer Bonding is recommended for these materials. Many materials have characteristics that are not amenable to sputterings, such as brittleness and low thermal conductivity.
More Information on Tin Oxide Sputtering Targets
Applications• Normal temperature low resistance• High conductivity • High density electrode materials |
Features• High purity• Custom sizes available |
Manufacturing Process• Manufacturing - Hot pressed - Sintered, Elastomer bonded to backing plate
• Cleaning and final packaging, Cleaned for use in vacuum, |
Options
• 99.99% minimum purity
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
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Related Products of Tin Oxide Sputtering Targets
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Ceramic Sputtering Targets |
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Evaporation Materials |
Crucibles N/A |
Metal Powders Tin Powder |
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