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Titanium Ferrite Sputtering Targets (TiFe2O4)

Material Type	Titanium Ferrite
Symbol	TiFe₂O₄
Color/Appearance	Various colors, Solid
Melting Point (°C)	N/A

Theoretical Density (g/cc)	N/A
Water Solubility	Insoluble
Sputter	RF, RF-R, DC
Type of Bond	Indium, Elastomer
Comments

Titanium Ferrite Sputtering Targets

Titanium Ferrite Sputtering Targets
Purity: 99.9%;
Circular: Diameter <= 14 inch, Thickness >= 1mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm.
Bonding is recommended for these materials. Many materials have characteristics that are not amenable to sputtering, such as brittleness and low thermal conductivity. This material may require a special ramp up and ramp down procedures. This process may not be necessary for other materials. Targets that have low thermal conductivity are susceptible to thermal shock.

More Information on Titanium Ferrite Sputtering Targets

Applications

• Ferroelectric
• Gate Dielectric

• For CMOS

Features

• High purity
• Custom sizes available

Manufacturing Process

• Manufacturing - Cold pressed - Sintered, Elastomer bonded to backing plate

• Cleaning and final packaging, Cleaned for use in vacuum,
Protection from environmental contaminants
Protection during shipment

Options

• 99.9% minimum purity

• Smaller sizes also available for R&D applications

• Sputtering target bonding service

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