Beryllium Sputtering Targets (Be)
Material Type | Beryllium |
Symbol | Be |
Atomic Weight | 9.0121831 |
Atomic Number | 4 |
Color/Appearance | White-gray Metallic |
Thermal Conductivity | 201 W/m.K |
Melting Point (°C) | 1278 |
Coefficient of Thermal Expansion | 11.3 x 10-6/K |
Theoretical Density (g/cc) | 1.85 |
Z Ratio | |
Sputter | RF, DC |
UN Number | 1567 |
Beryllium Sputtering Targets
Beryllium is a chemical element with the symbol Be and atomic number 4. It is a relatively rare element in the universe, usually occurring as a product of the spallation of larger atomic nuclei that have collided with cosmic rays. Within the cores of stars, Beryllium is depleted as it is fused and creates larger elements. It is a divalent element that occurs naturally in minerals only with other elements. Notable gemstones which contain Beryllium include Beryl (Aquamarine, Emerald) and Chrysoberyl. It is a steel-gray, strong, lightweight, and brittle alkaline earth metal as a free element. The Beryllium sputtering target can be used as an inherent filter on an X-ray tube that is important to determine X-ray energy.
Beryllium Sputtering Targets Information
Beryllium Sputtering Targets
Purity: 98.5% - 99.9%;
Circular: Diameter <= 14 inch, Thickness >= 1mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm.
More Information on Berylium Sputtering Targets
Applications• Electronics• Semiconductor • Flat panel displays |
Features• Competitive pricing• High purity • Grain refined, Engineered microstructure • Semiconductor grade |
Manufacturing Process• RefiningThree-layer electrolytic process • Melting and casting Electrical resistance furnace - Semi-continuous casting • Grain refinement Thermomechanical treatment • Cleaning and final packaging - Cleaned for use in vacuum Protection from environmental contaminants Protection during shipment |
Options• 98.5% minimum purity• Smaller sizes also available for R&D applications • Sputtering target bonding service |
Related Products of Beryllium Sputtering Targets
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Ceramic Sputtering Targets N/A |
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Evaporation Materials
N/A
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Crucibles N/A |
Metal Powders N/A |
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