Platinum Sputtering Targets (Pt)
| Material Type | Platinum |
| Symbol | Pt |
| Atomic Weight | 195.084 |
| Atomic Number | 78 |
| Color/Appearance | Metallic Gray |
| Thermal Conductivity | 72 W/m.K |
| Melting Point (°C) | 1,772 |
| Coefficient of Thermal Expansion | 8.8 x 10-6/K |
| Theoretical Density (g/cc) | 21.45 |
| Z Ratio | 0.245 |
| Sputter | DC |
|
Max Power Density* (Watts/Square Inch) |
100 |
| Type of Bond | Indium, Elastomer |
| Comments | Alloys with metals. Films soft, poor adhesion. Temperatures required to achieve deposition may not be practical for thermal evaporation. |
Platinum Sputtering Targets
Pure platinum is a lustrous, ductile, and malleable, silver-white metal. Platinum is more ductile than Gold, Silver, or Copper. Thus being the most ductile of pure metals, but it is less malleable than Gold. The metal has excellent corrosion resistance, is stable at high temperatures, and has stable electrical properties. Platinum reacts with Oxygen slowly at very high temperatures. It reacts vigorously with Fluorine at 500 C (932 F) to form platinum tetrafluoride. It is also attacked by Chlorine, Bromine, Iodine, and Sulfur. Platinum is insoluble in hydrochloric and nitric acid but dissolves in hot aqua regia(Nitric acid hydrochloride) to form chloroplatinic acid, H2PtC.
Platinum Sputtering Targets Information
Platinum Sputtering Targets
Purity: 99.99%;
Circular: Diameter <= 14 inch, Thickness >= 1mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm.
More Information on Platinum Sputtering Targets
Applications• Electronics• Semiconductor • Flat panel displays |
Features• Competitive pricing• High purity • Grain refined, Engineered microstructure • Semiconductor grade |
Manufacturing Process• RefiningThree-layer electrolytic process • Melting and casting Electrical resistance furnace - Semi-continuous casting • Grain refinement Thermomechanical treatment • Cleaning and final packaging - Cleaned for use in vacuum Protection from environmental contaminants Protection during shipment |
Options• 99.99% minimum purity• Semiconductor grade aluminum alloys available Al/Si,Al/Cu,Al/Cu/Si • Planar circular targets up to 18'' (457mm) diameter • Planar tiles up to 48'' (1200mm) X 15.75'' (400mm) for larger target configurations • Smaller sizes also available for R&D applications • Sputtering target bonding service |
Related Products of Platinum Sputtering Targets
|
|
Ceramic Sputtering Targets N/A |
|
|
Evaporation Materials Platinum Evaporation Pellet |
Crucibles Platinum Crucible |
Metal Powders N/A |
Click to download datasheet about Platinum Sputtering Targets (Pt)
Unable to find the required data sheet? Click here to send an email and get it.
Click here to get answers to Frequently Asked Questions (FAQ).
Related Products
FREE QUOTE