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Ruthenium Sputtering Targets (Ru)

Material Type	Ruthenium
Symbol	Ru
Atomic Weight	101.07
Atomic Number	44
Color/Appearance	Silvery White Metallic
Thermal Conductivity	120 W/m.K
Melting Point (°C)	2,310
Coefficient of Thermal Expansion	6.4 x 10-6/K

Theoretical Density (g/cc)	12.3
Z Ratio	0.182
Sputter	DC
Max Power Density* (Watts/Square Inch)	100
Type of Bond	Indium, Elastomer

Ruthenium Sputtering Targets

Ruthenium is a chemical element with the symbol Ru and atomic number 44. It is a rare transition metal belonging to the platinum group of the periodic table. Like the other metals of the platinum group, ruthenium is inert to most other chemicals. Ruthenium is usually found as a minor component of platinum ores. Its annual production is about 20 tonnes. Most of the produced ruthenium is used in wear-resistant electrical contacts and thick-film resistors. A minor application for ruthenium is in Platinum alloys and as a chemistry catalyst.

Ruthenium Sputtering Targets Information

Ruthenium Sputtering Targets
Purity: 99.9%;
Circular: Diameter <= 14 inch, Thickness >= 1mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm.
Bonding is recommended for these materials. Many materials have characteristics that are not amenable to sputtering, such as brittleness and low thermal conductivity. This material may require a special ramp up and ramp down procedures. This process may not be necessary for other materials. Targets that have low thermal conductivity are susceptible to thermal shock.

More Information on Ruthenium Sputtering Targets

Applications • Electronics • Semiconductor • Flat panel displays	Features • Competitive pricing • High purity • Grain refined, Engineered microstructure • Semiconductor grade
Manufacturing Process • Refining Three-layer electrolytic process • Melting and casting Electrical resistance furnace - Semi-continuous casting • Grain refinement Thermomechanical treatment • Cleaning and final packaging - Cleaned for use in vacuum Protection from environmental contaminants Protection during shipment	Options • 99.9% minimum purity • Smaller sizes also available for R&D applications • Sputtering target bonding service

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