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Tellurium Sputtering Targets (Te)

Material Type	Tellurium
Symbol	Te
Atomic Weight	127.6
Atomic Number	52
Color/Appearance	Silvery Lustrous Gray, Semi-Metallic
Thermal Conductivity	3 W/m.K
Melting Point (°C)	449

Theoretical Density (g/cc)	6.25
Z Ratio	0.9
Sputter	RF
Type of Bond	Indium, Elastomer
UN Number	3284
Comments	Wets without alloying.

Tellurium Sputtering Targets

Tellurium has two allotropes, crystalline and amorphous. Tellurium is silvery-white with a metallic luster when it is crystalline. It is a brittle and easily pulverized metalloid. Amorphous tellurium is a black-brown powder prepared by precipitating it from a solution of tellurous acid or telluric acid (Te(OH)6). Tellurium is a semiconductor that shows a more excellent electrical conductivity in specific directions depending on atomic alignment. The conductivity increases slightly when exposed to light (photoconductivity). Molten tellurium is corrosive to Copper, Iron, and stainless steel. Tellurium has the highest melting and boiling points of the chalcogens, at 722.66 K (841.12 ℉) and 1,261 K (1,810 ℉), respectively.

Tellurium Sputtering Targets Information

Tellurium Sputtering Targets
Purity: 99.999%;
Circular: Diameter <= 14 inch, Thickness >= 1mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm.
Some materials and manufacturing methods may yield a product with higher than average porosity. Performance may be affected according to the process's requirements.

More Information on Tellurium Sputtering Targets

Applications • Electronics • Semiconductor • Flat panel displays	Features • Competitive pricing • High purity • Grain refined, Engineered microstructure • Semiconductor grade
Manufacturing Process • Refining Three-layer electrolytic process • Melting and casting Electrical resistance furnace - Semi-continuous casting • Grain refinement Thermomechanical treatment • Cleaning and final packaging - Cleaned for use in vacuum Protection from environmental contaminants Protection during shipment	Options • 99.99% minimum purity • Smaller sizes also available for R&D applications • Sputtering target bonding service

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