AZO Sputtering Targets (Al2O3/ZnO 2/98 wt%)

AZO Sputtering Targets

Our standard sputtering targets for thin film are available monoblock or bonded with planar target dimensions and configurations up to 820 mm with hole drill locations. Furthermore, threading, beveling, grooves, and backing are designed to work with both older sputtering devices and the latest process equipment. Some application examples are large area coating for solar energy or fuel cells and flip-chip applications. Research sized targets are also produced as well as custom sizes and alloys. All targets are analyzed using best-demonstrated techniques, including X-Ray Fluorescence (XRF), Glow Discharge Mass Spectrometry (GDMS), and Inductively Coupled Plasma (ICP). "Sputtering" allows for thin film deposition of an ultra-high purity sputtering metallic or oxide material onto another solid substrate. This process is done by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment.
 

AZO Sputtering Targets Information

AZO Sputtering Targets
Purity: 99%, 99.9%, 99.99%.
Circular: Diameter <= 14 inch, Thickness >= 1 mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1 mm.
Not only rectangular size sputtering targets, but we also provide annular sputtering targets, rotary sputtering targets, or oval sputtering targets. Materials are produced using crystallization, solid-state, and other ultra high purification processes such as sublimation. Target bonding service is also provided, including Indium Metallic Bonding and Epoxy Bonding.

Deposition Procedure of AZO Sputtering Targets

Higher power and greater thicknesses produce lower sheet resistances. 

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