Boron Carbide Sputtering Targets (B4C)
| Material Type | Boron Carbide |
| Symbol | B4C |
| Melting Point (°C) | 2,350 |
| Theoretical Density (g/cc) | 2.37 |
| Z Ratio | **1.00 |
| Sputter | RF |
|
Max Power Density* (Watts/Square Inch) |
20 |
| Type of Bond | Indium, Elastomer |
| Comments | Similar to chromium. |
Boron Carbide Sputtering Targets
Boron carbide (chemical formula approximately B4C) is tough boron–carbon ceramic and covalent material used in tank armor, bulletproof vests, engine sabotage powders, and numerous industrial applications. With a Vickers Hardness of >30 GPa, it is one of the hardest known materials, behind cubic boron nitride and diamond. The use of high-density boron and boron carbide (B4C) and a vacuum-brazed target design is required to achieve the required sputter process stability and resistance to the thermal stress created by high rate sputtering.
Boron Carbide Sputtering Targets Information
Boron Carbide Sputtering Targets
Purity: 99.5%;
Circular: Diameter <= 14 inch, Thickness >= 1mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm.
Indium bonding is recommended for this material due to its characteristics not amenable to sputtering like brittleness and low thermal conductivity. This material has a low thermal conductivity and susceptible to thermal shock.
More Information on Boron Carbide Sputtering Targets
Applications
• Chemical Vapor Deposition (CVD) • Optical |
Features• High purity• Custom sizes available |
Manufacturing Process• Manufacturing - Hot pressed - Sintered, Elastomer bonded to backing plate
• Cleaning and final packaging, Cleaned for use in vacuum, |
Options
• 99.5% minimum purity
• Smaller sizes also available for R&D applications
• Sputtering target bonding service
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Related Products of Boron Carbide Sputtering Targets
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Ceramic Sputtering Targets |
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Evaporation Materials Boron Carbide Pellet |
Crucibles Boron Nitride Crucible |
Metal Powders N/A |
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